Wafer downsizing is possible, water jet laser processing.
It is possible to downsize various wafers using water jet laser processing, which excels at machining difficult materials like SiC with minimal heat impact.
Using a water jet laser, it is possible to downsize a 12-inch silicon wafer to 8 inches. We offer contract processing for various wafers including silicon, SiC, patterned wafers, and GaN. Additional processing with a water jet laser results in minimal thermal impact, ensuring damage-free outcomes without chipping on either side. It is also possible to add notches and orifices in compliance with SEMI standards. Even for SiC, which is typically considered a difficult material to machine, the high absorption rate of the laser allows for additional processing that is not achievable with conventional machining. Please feel free to contact us for more information.
- Company：ナラサキ産業 メカトロソリューション部 機能材料課
- Price：Other
